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LSLM 500 Stepper Lithography Machine
Features
Precise Pattern Transfer: It can accurately transfer the mask pattern to the substrate surface at a reduced scale, ensuring the high precision and consistency of microscopic circuit elements, which is essential for the normal operation of integrated circuits.
High Integration Adaptability: It supports the formation of millions of microscopic circuit elements on a single tiny silicon wafer, adapting to the high integration requirements of small- and medium-scale integrated circuits and meeting the demand for dense circuit layout.
Wide Application Scope: It is widely used in the R&D and production of small- and medium-scale ICs, semiconductor devices, and surface acoustic wave devices, covering multiple fields of the semiconductor industry and having strong versatility.
Core Process Support: As a key equipment in the IC manufacturing process, it connects the mask design and wafer fabrication links, providing a critical guarantee for the smooth progress of the entire complex manufacturing process.
Stable and Reliable Performance: It features stable operation and high reliability, which can meet the long-term continuous production needs of industrialization and the high-precision requirements of laboratory research.
Product Parameters
| Item | Technical Specification |
| Product name | Stepper lithography machine |
| Product model | LSLM 500 |
| Wafer Size | 4-inch, 6-inch, 8-inch, 12-inch |
| Exposure light source | UV-LED |
| Resolution | Develop 500 nm, 400 nm, 300 nm, and 150 nm sequentially |
| Alignment accuracy | 150 nm |
| Exposure method | Stepped projection type |
| Scaling ratio | 1:7 |
| Feature size uniformity (CDU) | ±10% |


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