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lslm-500.webp

High-Precision LSLM 500 Stepper Lithography Machine for ICs - Trusted China Suppliers and Factory

Introducing a state-of-the-art apparatus for manufacturing integrated circuits that effectively transfers mask patterns at a reduced scale onto the substrate surface. This innovative technology facilitates the creation of millions of microscopic circuit elements on miniature silicon wafers, playing a vital role in complex semiconductor processes. Ideal for both research and production, this equipment is essential for small- and medium-scale integrated circuits, semiconductor devices, and surface acoustic wave devices. As a leading supplier in China, our factory is dedicated to delivering high-quality manufacturing solutions to meet the demands of the ever-evolving electronics industry
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    Key Advantages

    Features
    • Precise Pattern Transfer

      It can accurately transfer the mask pattern to the substrate surface at a reduced scale, ensuring the high precision and consistency of microscopic circuit elements, which is essential for the normal operation of integrated circuits.

    • High Integration Adaptability

      It supports the formation of millions of microscopic circuit elements on a single tiny silicon wafer, adapting to the high integration requirements of small- and medium-scale integrated circuits and meeting the demand for dense circuit layout.

    • Wide Application Scope

      It is widely used in the R&D and production of small- and medium-scale ICs, semiconductor devices, and surface acoustic wave devices, covering multiple fields of the semiconductor industry and having strong versatility.

    • Core Process Support

      As a key equipment in the IC manufacturing process, it connects the mask design and wafer fabrication links, providing a critical guarantee for the smooth progress of the entire complex manufacturing process.

    • Stable and Reliable Performance

      It features stable operation and high reliability, which can meet the long-term continuous production needs of industrialization and the high-precision requirements of laboratory research.

    Product Parameters
    Item Technical Specification
    Product Name Stepper lithography machine
    Product Model LSLM 500
    Wafer Size 4-inch, 6-inch, 8-inch, 12-inch
    Exposure Light Source UV-LED
    Resolution Develop 500 nm, 400 nm, 300 nm, and 150 nm sequentially
    Alignment Accuracy 150 nm
    Exposure Method Stepped projection type
    Scaling Ratio 1:7
    Feature Size Uniformity (CDU) ±10%
    Frequently Asked Questions
    Q
    What wafer sizes does the LSLM 500 stepper lithography machine support?
    The LSLM 500 supports 4-inch, 6-inch, 8-inch, and 12-inch wafers, making it compatible with a wide range of semiconductor manufacturing processes and production scales.
    Q
    What is the resolution capability of the LSLM 500 stepper lithography machine?
    The LSLM 500 is capable of sequentially developing resolutions of 500 nm, 400 nm, 300 nm, and 150 nm, providing the precision required for small- and medium-scale integrated circuit fabrication.
    Q
    What type of exposure light source does the LSLM 500 use?
    The LSLM 500 uses a UV-LED exposure light source, which offers stable output, energy efficiency, and long operational lifespan compared to traditional lamp-based systems.
    Q
    What industries and applications is the LSLM 500 suitable for?
    The LSLM 500 is widely used in the R&D and production of small- and medium-scale ICs, semiconductor devices, and surface acoustic wave devices, serving both industrial manufacturing and laboratory research environments.
    Q
    What is the alignment accuracy of the LSLM 500?
    The LSLM 500 achieves an alignment accuracy of 150 nm, ensuring precise layer-to-layer registration critical for reliable multi-layer integrated circuit fabrication.
    Q
    What is the scaling ratio of the LSLM 500 and why does it matter?
    The LSLM 500 operates at a scaling ratio of 1:7, meaning the mask pattern is reduced to 1/7 of its original size when projected onto the wafer. This demagnification enables the accurate transfer of fine circuit features at the microscale, which is fundamental to achieving high-density integrated circuit layouts.

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