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lslm-500.webp

China LSLM 500 Stepper Lithography Machine - Leading Suppliers & Factory for Integrated Circuit Manufacturing

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Introducing a cutting-edge apparatus for manufacturing integrated circuits that effectively transfers mask patterns at a reduced scale to the substrate surface for exposure. This advanced technology facilitates the creation of millions of microscopic circuit elements on a small silicon wafer, playing a vital role in the fabrication of complex integrated circuits. Our product is ideal for research and production in small- and medium-scale integrated circuits, semiconductor devices, and surface acoustic wave devices. As a leading China supplier and factory, we are dedicated to providing high-quality solutions that meet the demands of the semiconductor industry.

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    Key Advantages

    Features
    Precise Pattern Transfer

    It can accurately transfer the mask pattern to the substrate surface at a reduced scale, ensuring the high precision and consistency of microscopic circuit elements, which is essential for the normal operation of integrated circuits.

    High Integration Adaptability

    It supports the formation of millions of microscopic circuit elements on a single tiny silicon wafer, adapting to the high integration requirements of small- and medium-scale integrated circuits and meeting the demand for dense circuit layout.

    Wide Application Scope

    It is widely used in the R&D and production of small- and medium-scale ICs, semiconductor devices, and surface acoustic wave devices, covering multiple fields of the semiconductor industry and having strong versatility.

    Core Process Support

    As a key equipment in the IC manufacturing process, it connects the mask design and wafer fabrication links, providing a critical guarantee for the smooth progress of the entire complex manufacturing process.

    Stable and Reliable Performance

    It features stable operation and high reliability, which can meet the long-term continuous production needs of industrialization and the high-precision requirements of laboratory research.

    Product Parameters
    Item Technical Specification
    Product name Stepper lithography machine
    Product model LSLM 500
    Wafer Size 4-inch, 6-inch, 8-inch, 12-inch
    Exposure light source UV-LED
    Resolution Develop 500 nm, 400 nm, 300 nm, and 150 nm sequentially
    Alignment accuracy 150 nm
    Exposure method Stepped projection type
    Scaling ratio 1:7
    Feature size uniformity (CDU) ±10%
    Frequently Asked Questions
    Q What wafer sizes does the LSLM 500 stepper lithography machine support?
    The LSLM 500 supports a wide range of wafer sizes including 4-inch, 6-inch, 8-inch, and 12-inch wafers, making it highly adaptable for both R&D laboratories and industrial-scale semiconductor production environments.
    Q What is the resolution capability of the LSLM 500?
    The LSLM 500 stepper lithography machine can achieve progressively finer resolutions of 500 nm, 400 nm, 300 nm, and 150 nm sequentially, enabling it to meet both current production requirements and evolving process needs for higher-density circuit layouts.
    Q What type of light source does the LSLM 500 use for exposure?
    The LSLM 500 uses a UV-LED light source for the exposure process. UV-LED technology offers stable and energy-efficient illumination, contributing to consistent patterning results and reliable long-term performance during continuous production runs.
    Q What applications is the LSLM 500 stepper lithography machine suitable for?
    The LSLM 500 is widely applicable in the R&D and manufacturing of small- and medium-scale integrated circuits (ICs), semiconductor devices, and surface acoustic wave (SAW) devices. Its versatility makes it a valuable piece of equipment across multiple sectors of the semiconductor industry.
    Q What is the alignment accuracy and scaling ratio of the LSLM 500?
    The LSLM 500 achieves an alignment accuracy of 150 nm, ensuring highly precise layer-to-layer registration during multi-step lithography processes. The machine operates with a scaling ratio of 1:7, allowing the mask pattern to be accurately reduced and transferred onto the substrate surface.
    Q What does the Feature Size Uniformity (CDU) specification of ±10% mean?
    Feature Size Uniformity (CDU) of ±10% refers to the degree of variation in the critical dimensions of patterned features across the wafer. A CDU of ±10% on the LSLM 500 indicates that the machine maintains tight control over feature sizes, which is critical for ensuring consistent electrical performance and yield across all circuit elements on the wafer.

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